AIT’s compressible thermal interface pads have been carefully engineered to provide the combination of automatic assembly and placement between modules and EV structural-cooling plate system, high-temperature long-term reliability, and end-of-life recycling ease as an integral part of the solution. Additional features include:

  • Low thermal resistance between cells to casing while providing UL V-0 fire-retardant as an integral part of the thermal conductivity engineering.
  • Proven more than 30 years in thermal management reliability, non-curing molecular flexibility is specifically engineered in the thermal interface padding to provide shock and stress absorption between module and the battery frame structure and cooling plate system.
  • Instead of high-strength thermal adhesives that are hard to recycle at the end of life, the non-bonding pads are easy to remove to recover the metals and other elements in the battery cells.

Gap and Surface Conforming, High Compressibility, Non-Curing, and Low Thermal Resistance Interface Pads:

  • Long proven history of commercial and military electronic usages for high reliability thermal interfacing
  • Shock absorbing mechanical interface engineered for ease in pick-and-place manufacturing operation
  • Intrinsically fire-retardant self-extinguishing (UL 94V-0) for vehicle safety
  • Designed for ease in reworking and end-of-life recycling for long-term viability

Gap and Surface Conforming with High Compressibility and Low Thermal Resistance Interface:

  • Instead of thermal adhesive bonding, a compressible pad that conforms to gaps over a large surface area for the thermal interface between modules and the cooling structural system is more suitable for rework and end-of-life recycling. AIT designs this solution for ease in disassembly and individual module layer by layer recycling.
  • AIT high compressible conforming pad has years of proven history of use in commercial and military systems for thermal management.
  • This compressible conformal pad is available for different thicknesses for use in both flat and prismatic cells thermal interfaces as well as a module to the cooling system.